Global Forecast of Data Communication Volume and DC Power Consumption
Data communication volume ZBIDCpower consumption Twh
Optimization of cooling system
·Select server cooling system based on DC requirements and environmentinorder to achieve efficient thermal management, improve energy efficiency, and ensure DC reliability, the cooling system needs to be optimized
·So far, the conventional cooling method is air cooling, but with the surge in data volume, highperformance and high density of equipment, the demand for water cooling and liquid coolingwith higher cooling efficiency is gradually increasing
|
|
No cooling |
air cooling |
water cooling |
liquid cooling |
|
Set the venue |
unrestricted |
unrestricted |
unrestricted |
According to the Fire Protection Law |
|
Necessary space |
Small |
big |
middle |
middle |
|
Weight |
light |
heavy |
heavy |
Heavy (practical without any problem) |
|
Cooling |
0% |
About 30% |
85% |
90% |
|
PUE |
2.0or above |
About 2.0 |
About 1.1 |
About1.05 |
|
Fault frequency |
Easy to |
Easy to |
Easy to |
Not prone to |
|
schematic |
|
|
|
ENEOS IX
IMMERSION COOLING FLUID
Type C Type H Type Z
Better cooling efficiency Excellent comprehensive performance safer
|
project |
unit |
OCP specification |
①Type C |
②Type H |
③Type Z |
|
Features |
low viscosity |
low viscosity |
High flash point |
||
|
density |
g/cm³ |
<2.000 |
0.831 |
0.809 |
0.809 |
|
Kinematic viscosity (40 C) |
mm²/s |
一 |
8.10 |
9.19 |
11.46 |
|
flash point |
℃ |
≥150 |
170 |
196 |
210 |
|
acid value |
Mg*KOH/g |
<0.01 |
0.01 |
0.01 |
0.01 |
|
Specific heat capacity (25°C) |
kJ/ kg·K |
1.83 |
1.97 |
1.98 |
|
|
Thermal conductivity (25° C) |
W/m·K |
一 |
0.148 |
0.143 |
0.155 |
|
Volume resistivity (25° C) |
TΩ·m |
一 |
>1 |
>1 |
>1 |
|
CFP |
normal |
normal |
normal |
ENEOS’s additive formulation technology delivers superior oxidative stability compared with conventional PAO.
Working principle of single-phaseimmersion cooling system
1. Waste heat from server (IC chipon board)The heat generated by the film is cooled after heatingThe iquid is discharged from the top of the rack.
2. Through the coolant pump (circulation pump)Extract the heated coolant.
3. Utilize cooling equipment (cooling tower)Cooling water for chillers, etcHeat exchange.
4.Coolant cooled by heat exchange Return to the rack.
The benefits of liquidimmersion cooling system
Electricity saving
Removal/invalidation of CPUFAN and PSUFAN in servers>>>Reduce server's ownpower consumption by 10-20%
Cost effectiveness improvement Protecting the temperature of the CPU during high load operation is lower thanair cooling>>>Can maintain continuous operation under high load conditions
Reduced server hardware failure rate Eliminate the three major causes of faults under air-cooled conditions
(1) Malfunctions caused by FAN vibration>>>Due to complete removal,there will be no vibration
(2) Local overheating fault>>>Fully immersed in liquid, evenly cooled,it is difficult for local overheating to occur
(3) Short circuit caused by dust adhesion>>>The substrate surface is protected by an oil film and will not be affected by dust 
